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TDA7010T

TDA7010T
TDA7010T TDA7010T
 
Part No:
TDA7010T
Manufactuer:
PHILIPS (NXP)
Category:
RF and Microwave
Package Type:
SOP
Description:
FM RADIO RECEIVER CIRCUIT ...

NowComponents has sourced and supplied TDA7010T and similar components since 1998. NowComponents is the global marketplace for electronic components with over 5 million lines of obsolete, allocated and discontinued electronic components.

Part Description

FM RADIO RECEIVER CIRCUIT / SOP-16PIN

Manufacturer Description

NXP was established in 2006 as a spin-off of the Philips Semiconductor Group with over 50+ years of experience in the semiconductor industry. NXP provides Mixed Signal and Standard Product solutions for RF, Analog, Power Management, Interface, Security, and Digital Processing applications. These products are used in the automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing markets. NXP is headquartered in Eindhoven, The Netherlands

Package Description

After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.

Manufacturer
PHILIPS (NXP)
Description
FM RADIO RECEIVER CIRCUIT / SOP-16PIN
Status
Preapproved
Package
SOP
Pin Count
0
Category
RF and Microwave