- Part No:
- SHINDENGEN AMERICA, INC. (SAI)
- Package Type:
- MCZ3001DB SHINDENGEN DIP- ...
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MCZ3001DB SHINDENGEN DIP-19 PACKAGE
Shindengen America, Inc. (SAI) is the North American subsidiary of Shindengen Electric Manufacturing Company, Ltd. (SEM), a Tokyo-based world leader in the development and manufacture of high-quality, reliable power conversion products. Their products include DC/DC converters, various types of rectifiers, transistors, and power ICs.
In microelectronics, a dual in-line package (DIP) is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. Dual-in-line packages were developed in the 1960s when the restricted number of leads available on transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated crcuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.
|SHINDENGEN AMERICA, INC. (SAI)|
|MCZ3001DB SHINDENGEN DIP-19 PACKAGE|